HTI Precision Manufacturing

Additive Inductive Coils

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Small Footprint Inductive Coupling Coils For Contactless Secure Data Transmission

  • Shown below are Technology Demonstration devices where the transmit and receive coils have been assigned to commercially available EEPROM chip dimensions
  • Can be custom tailored to your specific design requirments
  • Benefits compared to industry standard
    • Smaller footprint
    • Lower power consumption
    • great field strength / force
    • Ability to fabricate 2 layer coils
    • Enable by high aspect ratio copper process
  • Advantage
    • Ablity to fabricate "in-package" in a higher level component
    • High density inductive coils enables small footprint contactless communication
    • Low electromagnetic emissions and low susceptibility to RF fields
    • Perfect for small devices that could benefit from contactless data transmission
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Small Footprint, High Power Coil Inductor for Contactless Power Transfer

  • Shown below is a Technology Demonstration Device in which harvested power illuminates a pair of LEDs
  • Can be customer tailored to your specific design requirements
  • Benefits compared to industry standard
    • Ability to fabricate 'in-package' in a higher level component
    • Ability to achieve much higher L/R ratio compared to traditional flex processes

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Single or Double Layer Coil Inductor for Near Field Power Transfer

  • Benefits compared to industry standard
    • Ability to fabricate 'in-package' in a higher level component
    • High density copper trace optimizes inductance relative to resistance
      • Much higher L/R ratio compared to traditional flex processes
    • More current is generated per coil area

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